Thermogravimetric study of the decomposition of printed circuit boards from mobile phones

  1. Ortuño, N.
  2. Moltó, J.
  3. Egea, S.
  4. Font, R.
  5. Conesa, J.A.
Journal:
Journal of Analytical and Applied Pyrolysis

ISSN: 0165-2370

Year of publication: 2013

Volume: 103

Pages: 189-200

Type: Conference paper

DOI: 10.1016/J.JAAP.2012.12.020 GOOGLE SCHOLAR
Data source: Scopus