Preparation of high surface area Cu-Au bimetallic nanostructured materials by co-electrodeposition in a deep eutectic solvent
- Plaza-Mayoral, E.
- Sebastián-Pascual, P.
- Dalby, K.N.
- Jensen, K.D.
- Chorkendorff, I.
- Falsig, H.
- Escudero-Escribano, M.
Revue:
Electrochimica Acta
ISSN: 0013-4686
Année de publication: 2021
Volumen: 398
Type: Article