Preparation of high surface area Cu-Au bimetallic nanostructured materials by co-electrodeposition in a deep eutectic solvent

  1. Plaza-Mayoral, E.
  2. Sebastián-Pascual, P.
  3. Dalby, K.N.
  4. Jensen, K.D.
  5. Chorkendorff, I.
  6. Falsig, H.
  7. Escudero-Escribano, M.
Revista:
Electrochimica Acta

ISSN: 0013-4686

Any de publicació: 2021

Volum: 398

Tipus: Article

DOI: 10.1016/J.ELECTACTA.2021.139309 GOOGLE SCHOLAR lock_openAccés obert editor
Font de les dades: Scopus