Surface characterization of copper electrocatalysts by lead underpotential deposition

  1. Sebastián-Pascual, P.
  2. Escudero-Escribano, M.
Revista:
Journal of Electroanalytical Chemistry

ISSN: 1572-6657

Ano de publicación: 2021

Volume: 896

Tipo: Artigo

DOI: 10.1016/J.JELECHEM.2021.115446 GOOGLE SCHOLAR lock_openAcceso aberto editor
Fonte de datos: Scopus